Polymer-based micro-optics can withstand the power levels in a laser.

KU Leuven and imec say wider spacing between µbumps and photonic device reduces heat problem of 3D integration.

Developers say approach “revolutionizes” camera performance.

Colorado researchers use new method to view items not visible by regular microscopy.

University of Birmingham EyeD device combines Raman spectroscopy and fundus imaging.

Integrating electronics with photonics has applications in satellites, wireless, and 6G telecoms.

Taiwan’s Yang Ming Chiao Tung team solves problem of haze in VR and other applications.

Milan, Glasgow, and Stanford university partners design chips to optimize light profile “for any environment.”

Temporal multiplex method tracks different emitters to image cellular responses.

NASA’s ISS-borne GEDI laser mapping 3D structure of forests to determine biodiversity.

University of Texas, Tau Systems, and partners demo compact particle accelerator yielding 10 GeV e-beam.

2.2MJ were delivered and 3.4MJ yielded in latest ignition experiment, at the end of October.