French company Laselec develops system to cut manufacturing waste.

“SCISSOR-G” system prototype uses sensor technology initially developed for aerial threat detection.

Copper, gold and tin-based deposition processes aid manufacture, functionality of integrated electronics devices.

UK-headquartered subsidiary of GSI Group also has plans to launch a 6 kW version next year.

Advanced semiconductor wafer foundry is boosted by progress in two photonics applications.

German and Dutch researchers and companies are refining short wavelength techniques that promise innovative chips and applications.

Multi-spot “TxCell” system is designed to improve laser treatment of serious retinal diseases.

A new software system and a deal with Daimler promote incorporation of the technology into manufacturing cycles.

US defense contractor’s 10 kW fiber laser system is latest to demonstrate real-world potential.

The company's distributed fiber sensing system will be installed along a 180 km oil pipeline corridor.

Lowers 10G link costs, boosts server integration, doubles reach, weighs 75% less than copper cable.

Conventional microscopy technique enables quick, cheap inspection of ultrathin materials.