European firms establish CMOS plant

17 Jun 2002

Philips Semiconductors and STMicroelectronics will invest USD 700 million to jointly build an advanced 12-inch wafer pilot-line fabrication site in Crolles, France.

The new pilot line will develop deep sub-micrometer semiconductor processes to 0.1 µm and below and is intended to keep both companies at the forefront of semiconductor technology. It will initially produce up to 1000 wafers per week but this will be increased to 2000 wafers per week if needed.

Site preparation and building of the plant will start this month and the first 12-inch wafers should be processed in around two year's time.

Philips and ST will have equal access to the plant's research and development and manufacturing capabilities. In addition to developing shared CMOS processes at 0.12 µm, 0.1 µm and below, both companies will also be free to develop process technology options.

The companies have had a technology cooperation agreement since 1992. They already share access to 0.18 µm logic CMOS technology and manufacturing at ST's wafer fabrication plant in Crolles.

SH