Irvine Sensors receives 3-D "Silicon Brain" R&D award

17 Jun 2002

Irvine Sensors Corporation (Costa Mesa, California) has received an 18-month contract from the United States Army Space and Missile Defense Command to demonstrate the feasibility of an ultra high density interconnect to enhance its 3D Artificial Neural Network technology. The interconnect is expected to lead to an eventual "Silicon Brain" recognition system which would emulate performance in the human central nervous system. The goal of the contract is to produce a 3D Field-Effect Transistor interconnect technology which can provide the physical architecture for the required massive chip-to-chip interconnect and solve the layer-to-layer high density input-output problem.