Shellcase, Tower will jointly develop CMOS package solutions

17 Jun 2002

ShellCase Ltd. (Jerusalem, Israel) and Tower Semiconductor Ltd. (Midgal Haemek, Israel) have announced a formal agreement for the joint development of wafer-level chip scale package solutions for integrated circuit fabrication. The development efforts will focus on applications of ShellCase's Opti-CSP (chip scale package) technology for the packaging of integrated circuits incorporating CMOS image sensors.