Laser Glass Processing Machine

22 Jan 2021

Laser machine for glass drilling, cutting, and more

• Drillable hole size 50 µm to 50 mm
• Substrate thickness from 50 µm to 8 mm
• Drilling speed up to 30 mm/s (0.5 mm glass)
• Scribing/marking speed up to 2000 mm/s
• Tolerance: < 50 µm
• Standalone and in-line system
• Customized laser solution available for various applications