09 Dec 2010 Altechna creates and develops laser systems for c-Si PV industry – from workstations for process optimization and research in low-volume industrial pilot lines to high-throughput turnkey systems for integrated Fabs manufacturing.
Sollas workstation is optimized for an industrial-research production line (capacity of 2.5 MWp/a) to perform four technological operations based on laser scribing, laser selective ablation and laser selective melting:
• selective SiNx SiO2 removal for emitter contact formation
• back contact laser firing
• edge isolation
• laser marking
Two independent laser working areas with
• high speed beam scanners (up to 10 m/s)
• high speed wafer positioning and recognition system(res. ~10 μm, accuracy ~100 μm)
• process vision system
Wafer handling system containing
• rotary table having eight seats for wafers
• two independent manipulators (load/unload) with vacuum forks
• four independent places for cassettes with 25 slots for 5 or 6 inch wafers
• active pneumatic anti-vibration system
Laser sources
• nanosecond 1064 nm fiber laser for scribing and firing processes
• femtosecond 1030 nm laser with TH generator (UV range) for selective SiNx ablation
Enclosure
• certified for class 1 laser safety
• dimensions 2.5x3x2 m
• power consumption 4 kW, compressed air – 5 atm, no water needed
Flexible software – with industrial and research modes |
