15 Jan 2008 Maximum flexibility for diverse device assembly requirements and applications. A 6-degree of independent axes platform for submicron precision alignment. Various bonding options, soldering, and laser welding with about 1 µm post-bond-shift accuracy. Today’s photonic devices are increasingly complex in design, configuration and application. Such factors, driven by the dynamic business environment, demand a versatile assembly system that can satisfy both performance and cost-of-ownership.
ficonTEC introduces the next-generation AL2000, which system architecture enables the maximum flexibility for diverse device assembly requirements and applications. The platform consists of 6-degree of independent axes for submicron precision alignment that addresses all possible degree of optical (and mechanical) axes, and almost equally accurate pick-and-place positioning capability. It provides various bonding options, including both UV- and thermal-epoxy, soldering, and laser welding with about 1 µm post-bond-shift accuracy. Various fully automated assembly processes have already been implemented. These include:
• FTTx transceiver assembly
• Laser array assembly (e.g., printing applications)
• Pressure sensors
• Miniature camera modules (e.g., automotive applications)
• Micro-lens positioning and assembly (via epoxy dispensing)
• Miniature solid state laser assembly (e.g., display applications)
• Planar parallel placement of CCD-arrays
The AL2000 embodies ficonTEC’s process expertise in various device assembly and automation, as the fully proven process is typically delivered with the system.
For further information please contact us at:
info@ficontec.com |
