ficonTEC is a recognized market leader for automated photonic assembly and test machine systems for all photonic devices comprising micro-optics, opto-electronic components and PICs (photonics integrated circuits). Considerable process capability and dedicated technologies have been accumulated in serving the needs of a broad selection of industry segments – including telecom and datacom, high-power diode laser assembly, sensing from bio-med to automotive, and more.
ficonTEC’s flexible and scalable automation options enable customized assembly and test solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume production facilities – regardless of whether for contract manufacturing or for in-house corporate R&D and production.
ficonTEC is an innovative high-tech company that has rapidly established itself in a highly-specialized market. With continued growth and innovative development since 2001, we are the recognized market leader when it comes to automated assembly and testing of opto-electronics components and (hybrid) photonic devices.
The alignment and bonding (assembly) of opto-electronic components, free-beam optics and/or fiber-optic pigtails into finished photonic devices is commonly referred to as photonics assembly, test and packaging. Typical devices include telecom/datacom transceivers and TOSA/ROSA, stacked laser diode bars and high-power multi-emitter assemblies, micro-optics, optofluidic systems, camera modules, fiber-coupled devices, photonics-based sensors, automotive LIDAR, and much more.
Automating the assembly process steps requires multi-axis, sub-micron-accuracy component alignment (passive/active) and subsequent bonding using epoxy compounds, laser-induced soldering and/or laser welding. In particular, in adhering to standard manufacturing practices, all assembly steps need to be compliant with stringent requirements for yield, process repeatability and performance reliability, while still enabling minimal process cycle time.
Devices also require testing, encompassing burn-in, LIV tests, characterization, validation, verification and mass production ‘go’ / ’no go’ testing from early prototyping (with multi-project wafers, MPW) to mass market production. It is required for simple devices such as laser diode chips and VCSELs, all the way up to complex photonics transceivers, compact camera modules (CCM), sensors, and other opto-electronics.
The automated machine solutions ficonTEC provides are directly involved in all of these processes on a daily basis. Considerable process capability as well as dedicated assembly technologies have been accumulated in serving the needs of a broad selection of industry segments – including telecom and datacom, high-power diode laser assembly, sensing from bio-med to automotive, micro-optics, and more.
Moreover, ficonTEC has consistently retained a unique modular approach to production equipment design. True to our ‘Photonics from Lab to Fab’ maxim, our flexible and scalable automation options enable customized assembly and testing solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume production facilities – regardless of whether for contract manufacturing or for in-house corporate R&D and production.
Today, with a globally installed base totaling many 100s of machines, each one is the automated and optimized embodiment of a customer-defined process. Our technical competence, worldwide contacts and – importantly – the will to understand our customer’s needs and to find individual and optimum solutions, together make us a competent business and development partner.