ficonTEC Service GmbH
ficonTEC is the recognized market leader for automated packaging and testing machine systems for high-end opto-electronic components and integrated photonic devices. Considerable process capability and dedicated assembly technologies have been accumulated over more than two decades of serving the needs of a broad selection of industry segments – including telecom and datacom, high-power diode laser assembly, IoT-conform sensor devices from bio-med to automotive, micro-optical modules, fiber-optics and more. ficonTEC’s flexible and scalable Industry 4.0 automation options enable customized assembly and test solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume manufacturing (HVM) – regardless of whether for contract manufacturing or for in-house corporate R&D and production.
Categories
Die-level testing systems
High-volume production lines
Photonic device development systems
Photonic device packaging systems
Wafer-level testing systems
