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Leonardo wins $134 M U.S. Army order for weapon sights…

07 Nov 2023

…and DoD awards contract to Mosaic to work with AIM Photonics to develop photonic interposers.

Leonardo DRS, has received an order for continued production of its next-generation thermal weapon sights for the U.S. Army. The production order for more than $134 million was made under the Family of Weapon Sights – Individual (FWS-I) IDIQ contract.

Leveraging DRS’ uncooled thermal imaging technology, FWS-I is a stand-alone, clip-on weapon sight that connects wirelessly to helmet-mounted vision systems including the enhanced night vision goggle binoculars and integrated visual augmentation system and provides rapid target acquisition capabilities to the soldier. It is specified to gives users the ability to acquire targets day or night and in smoke or fog, which provides strategic and tactical advantages to the soldier.

“This technology ensures our soldiers will have the most advanced weapon sight systems on the battlefield today. We are proud the U.S. Army recognizes us as a trusted partner to continue to deliver this vital technology,” commented Jerry Hathaway, senior VP and general manager of DRS’s Electro-Optical Infrared Systems business.

US DoD awards contract to Mosaic to develop photonic interposers with AIM Photonics

Mosaic Microsystems, a developer of microelectronics glass packaging technology, has been awarded a Phase II Small Business Innovation Research contract by the U.S. Department of Defense. Under the contract, Mosaic will develop ultra-thin glass interposers with through-glass via technology. These cutting-edge interposers will serve as the foundation for a high-speed packaging solution designed for analog and digital electronics and photonics.

As part of this transformative initiative, in collaboration with the American Institute for Manufacturing Integrated Photonics, Mosaic will demonstrate the integration of fiber optics, waveguides, and photonic integrated circuits with glass. Financial terms of the award were not disclosed.

Advanced application-specific integrated circuit or PIC-based systems currently rely on a silicon substrate for the electronic interposer or electronic and photonic interposer and an organic laminate substrate for RF signals, power, and control.

Mosaic’s effort will leverage the capabilities of AIM Photonics’ Test, Assembly and Packaging facility to develop photonics-enabled glass interposers. This approach will apply not only to defense technology but also to commercial applications.

By introducing thin glass photonic interposers, Mosaic says it is seeking to demonstrate substantial cost savings, reduced size and weight, and enhanced overall performance over current solutions. These advantages are expected to have far-reaching implications for future digital communications and have the potential to shape the future of 5G and “Next G” technologies.

“This DoD SBIR Phase II contract supports our team’s ability to drive technological innovations in the important area of photonics packaging,” said Shelby Nelson, CTO and co-founder at Mosaic. “We are thrilled to collaborate with AIM Photonics TAP on this venture, as we help build the future of electronics, photonics, and communications technologies.”

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