16 Sep 2003
The pick of this week’s patent applications including a laser system that can drill 500 holes per second in dielectric substrates.
• Title: Laser machining method
Applicant: Siemens Aktiengesellschaft, Germany
International application number: WO 03/074224
Patent application WO 03/074224 describes a laser system for rapidly drilling holes in dielectric substrates. It uses a Q-switched CO2 laser producing pulses shorter than 200 nanoseconds at a repetition rate greater than 50 kHz. The authors say that these lasing parameters result in the rapid machining of high-quality cylindrical or conical holes. “For example, 500 holes per second can be drilled in a 0.4-mm thick LCP substrate” say the authors.
• Title: Optical pulse analyzer
Applicant: Aelis Photonics (Israel) Ltd, Israel
International application number: WO 03/075490
An Israeli company is trying to patent a method for characterizing optical pulses. The authors say the method relies on the assumption that the pulses in the pulse train all have “substantially the same shape”. The first step is to detect photons from the pulses in the pulse train. The time lapse between detecting the first photon and a subsequent photon is then stored in a memory. After accumulating a set amount of time-lapse data, the authors say they are then able to characterize the pulses in the train.
• Title: Electronic display device
Applicant: Koninklijke Philips Electronics NV, the Netherlands
International application number: WO 03/075369
Patent application WO 03/075369 details a polymer LED display being developed by consumer electronics giant Philips. The device comprises a filter layer and a semi-transparent reflective layer that transmits the light emitted by the polymer LED display. “Due to the reflective properties of the semi-transparent reflective layer, the electrical connection of the polymer LEDs are hidden while the brightness of the display is maintained,” say the display’s inventors.