ficonTEC launches DLT-D1, a multi-site die-level tester for double-sided compact 3D CPO optical engines

20 Oct 2025

ficonTEC has announced the launch of the DLT-D1, a next-generation high-throughput, multi-site parallel test handler designed specifically for double-sided compact optical engines. The DLT-D1 extends ficonTEC’s industry-leading Co-Packaged Optics (CPO) test ecosystem, addressing the growing demand for 2.5D and 3D CPO architectures in high-performance computing (HPC) and data switching applications.

The system supports everything from DC parametric measurements to full data-rate RF testing, combining active optical alignment from the bottom-side of the device under test (DUT) with high-frequency electrical probing from the top-side. For DUTs with receptacles attached, the DLT-D1 can alternatively provide automated fiber coupling. A fully automated JEDEC magazine tray loader streamlines device handling, making the platform ideally suited for OSATs and other high-volume production environments.

Engineered for maximum productivity, the DLT-D1 can operate with up to three parallel test heads connected to either automated test equipment (ATE) or dedicated instrumentation. This scalable configuration significantly reduces test cost while maintaining high repeatability, helping customers accelerate time-to-market.

With the addition of the DLT-D1 to its previously announced double-sided wafer-level tester (WLT-D2) and single-sided wafer-level tester (WLT-S2), ficonTEC now delivers the industry’s most comprehensive test portfolio – from wafer to die-level – all built on a unified software interface and common test data framework.

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