The Angulares™ Hybrid Hexapod
23 Jun 2020
The 60-degree tip/tilt travel of the AngularesTM Hybrid Hexapod® is by far the most angular travel range available from any 6-Degree-Of-Freedom (6-DOF) positioner on the market and offers the same unmatched positioning performance found in any of ALIO’s full-line of Hybrid Hexapod systems.
The AngularesTM features precision crossed roller bearing guides, optical incremental or absolute encoder feedback on all axes, linear motor and/or servo ball screw drives, unlimited programmable tool center point locations and coordinate offsets, and zero backlash on all axes. The design makes the AngularesTM capable of unlimited XY travel, Z travel for 62 mm which can be increased to 208 mm using other tripod models, tip/tilt travel of 60 degrees (+/- 30 degrees) with continuous 360 degree Theta-Z, XYZ bidirectional repeatability of less than +/- 100nm, velocity up to 100 mm/second XY and Z, and less than 10 nanometers linear and 0.1 arc-seconds angular minimum incremental motion.
The Hybrid Hexapod® was developed by ALIO Industries to address the inherent performance limitations of conventional hexapods. ALIO’s Patented 6-DOF design seamlessly blends and takes advantage of the strengths of serial and parallel kinematic structures while avoiding their weaknesses. The Hybrid Hexapod offers far greater functional versatility, nanometer-level accuracy, repeatability, and superior 6-DOF trajectories than is possible with any traditional hexapod or stacked stage configuration.
In this hybrid design, individual axes can be customized to provide XY travel ranges from millimeters to virtually unlimited ranges while maintaining nanometer-levels of precision. Novel forward and inverse controller kinematics provide an unlimited number of programmable tool center point locations plus unmatched path precision and performance.
The 60 degree tip/tilt travel of the AngularesTM Hybrid Hexapod®, by far the most angular travel range available from any 6-DOF positioner on the market, is perfectly suited for applications including aspheric and freeform optical metrology, silicon photonics packaging and probing, laser micro processing (non-planar substrates and taper control), wafer metrology, camera module alignment and assembly, sensor/image stabilization testing, and optical element and fiber alignment.
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