A new member to ficonTEC's portfolio is the thermocompression die bonder BL500-M.
High forces of up to 800 N in combination with a heating process and a split optic make it possible to bond large dies, e.g. in flip-chip arrangements. Of course a highly accurate linear motor and torque motor driven motion system are part of the machine. The special arrangement of the motion stages makes the BL500-M an ideal tool for wafer level packaging applications.
