28 Jul 2009 New 1MDL06 Series of Thermoelectric coolers for telecom industry is available. TECs have the same size and form factor as most popular telecom types, but cooling capacity is up to 100% higher. 1MDL06 Series of thermoelectric coolers is based on HD (High Density) pellets placement technology. HD TECs have about 40% more pellets (Bi-Te couples inside TEC) on the same size as regular types. Together with ultra-low pellets it increases TEC cooling capacity up to 100% and even higher. 1MDL06 TECs can be used in telecom applications standard TECs are not suitable. Usually in case if significant heat amount to be dissipated, application developers have to switch from standard "Butterfly" to HHL package, which increases costs and sizes of final product. New HD TECs expand the application area of typical "Butterfly" packages. In the same time, applying of 1MDL06 TECs in regular application reduces power consumption for 20-40% if to compare with standard TECs. | 
