12 May 2009 Optocap Ltd, a leading provider of advanced packaging and assembly services announces the release of its “Turn-Key Packaging Platform” for fiber coupling of Optoelectronic devices. Optocap’s standard platform provides several key benefits;
• Avoids Design and Development NRE charges.
• Utilises Telcordia/Space compliant processes and materials.
• Enables faster time to market by utilising off-the-shelf components and avoiding key technical pitfalls.
• Provides competitive unit prices based on automated assembly processes and utilising economies of scales for purchasing materials.
Optocap’s standard platform has the following features;
• Wide range of packages including 14-pin butterfly and TO-cans.
• PM, SM, MM, Polycrystalline, High temperature fibres and FVA’s.
• Wide range of devices and wavelengths including DFB, DBR lasers, SOA’s, SLD’s VCSEL’s, Photodiodes and Quantum Cascade lasers
• Isolators and Free-Space optics
• Thermistor, TEC and Monitor Photodiode |
