23 Apr 2009 VarioLas mask imaging and line-beam systems are affordable tools for large-area precision machining. Superior optics, ruggedized mechanics and unmatched pulse stability are the key ingredients to each member of the VarioLas family - available for UV wavelengths 193 nm, 248 nm and 308 nm.
VarioLas mask imaging systems ECO and PRO provide micromachining resolutions of 30 µm and 5 µm, respectively, at a rectangular field size of 2 x 2 sq mm and are ideal for UV-machining of materials such as polymers, semiconductors, ceramics or glasses and as well for Laser Lift-Off (LLO) tasks. VarioLas SWEEP supports large-area processing with a homogeneous 50 x 0.6 sq mm line-beam for scanning applications such as wafer dopant activation, laser lift-off or surface annealing. Each VarioLas version can be upgraded to best match the individual requirements. |
