16 Jan 2006 Master Bond Inc, Hackensack, NJ has developed a new easy to use two component epoxy adhesive for high performance bonding applications called EP30. It develops outstanding physical strength properties even when cured at ambient temperatures. Cure can be accelerated by use of moderate heat. EP30 features very low viscosity along with outstanding chemical resistance, dimensional stability, hardness and superb optical clarity. Electrical insulation properties are superior even upon prolonged exposure to moisture. EP30 is widely used in potting and encapsulating electronic components as well as in bonding optical elements.
Master Bond EP30 has excellent adhesion to a wide variety of substrates including metals, ceramics, glass and many plastics. Typically, the lap shear strength exceeds 3,000 psi for aluminum to aluminum bonds. EP30 also has exceptionally low shrinkage upon cure. It is especially suited for assemblies where only very thin bond lines are dictated by design considerations.
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