Date Announced: 05 Nov 2012
State-of-the-art HMI solutions from the combined experience of system elektronik and Berliner Glas continues. Production capacity for assembly under clean room conditions is being doubled and capacity for optical bonding increased almost tenfold due to high demand for bonded HMI assemblies.
A new automatic dispensing and positioning system will be operational as of the middle of November 2012. Assembly and adhesive dispensing tolerances will be optimized resulting in improvements in the optical and functional properties of HMI assemblies. Both firms have contributed their extensive expertise in glass processing, bonding, display and touchscreen technology to this advancement. Berliner Glas and system elektronik continue their close partnership advancing the design, development, and production of premium touchscreen solutions tailored to their customers needs.
Both companies will be presenting a broad spectrum of their products and solutions at the Electronica in Munich (held from: Nov. 13-16, 2012) in Hall A3, booth 325.
E-mail: freiding@berlinerglas.de
Web Site: www.berlinerglas.com
© 2024 SPIE Europe |
|