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Date Announced: 06 Aug 2012
Pilot Installation of BIPV at key Apple contract manufacturer.
THORNTON, Colo.--(BUSINESS WIRE)--Ascent Solar Technologies, Inc. (NASDAQ:ASTI), a developer of state-of-the-art, flexible thin-film photovoltaic modules, announced today that it has been selected to provide BIPV solar modules in a pilot application at Foxconn’s new factory in Zhenzhou City, Henan Province, China. Foxconn is the world’s largest maker of electronic devices and produces many products including the iPad®, iPhone®, Kindle®, Playstation® and Xbox®.
Ascent’s modules’ flexible and lightweight form factor allows the modules to be integrated seamlessly into the building structure in ways traditional glass-back photo-voltaic technology cannot. The integration of the modules will allow the factory to utilize cost-effective, high-performance solar power utilizing Ascent’s industry leading CIGS technology to deliver the highest power density available on thin-film plastic substrates.
Ascent Solar’s President and CEO, Victor Lee, said, “We are honored to be selected by Foxconn to provide our lightweight, durable, flexible thin-film solar modules in this new factory. We plan to demonstrate the value of our technology and we hope to build a long term relationship with Foxconn.”
Source: Ascent Solar
E-mail: via web site
Web Site: www.ascentsolar.com
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