| One of ASML's key metrics for EUV lithography tool development is the number of wafers that can be exposed each hour. This chart shows how that figure has steadily risen from 9 wafers per hour in early 2014, to the latest 140 wafers per hour figure revealed at the SPIE Advanced Lithography conference in San Jose (shown in blue). Key to the increase has been advancing the power of the laser-driven EUV light source that sits at the heart of each tool. Results with ASML's "NXE:3300B" tool are shown in red, with the "NXE:3350B" in yellow, and the latest "NXE:3400B" in green and blue. Data: ASML. |
