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Trumpf and Schmid developing new process to cut cost of microchips

23 Jan 2025

Combined laser etching process enables advanced packaging with glass instead of silicon.

Germany-based technical systems developers Trumpf and Schmid Group are together working on an innovative manufacturing process designed to improve microchip generation for the global chip industry. The aim is to enable manufacturers to increase the performance of high-end electronic components for smart phones, smart watches, and AI applications.

In the process known as advanced packaging, manufacturers combine individual chips on silicon components known as interposers. With the process from Trumpf and Schmid, these interposers can be made of glass in the future.

“Advanced packaging with glass is a crucial future technology for the semiconductor industry. Glass is significantly cheaper than silicon. This will enable manufacturers to reduce production costs and make high-performance end devices much more affordable for customers,” said Christian Weddeling, Business Development Manager at Trumpf, who is responsible for semiconductors.

The partners are developing a combined laser-etching process for advanced packaging with glass. The two companies use a special approach to wet chemistry that shortens process times by a factor of ten. “For this to work well, the laser and wet chemistry must be very well coordinated,” says Weddeling.

Close partnership

The manufacturing process requires extreme care and precision. This is because the glass used is only between 100 µm and 1 mm thick. To create connections on the interposer, manufacturers have to drill holes through the glass, so-called through-glass vias (TGV). Manufacturers often have to create millions of holes in a panel to make the desired connections.

“It is the combination of Trump’s laser technology and the SCHMID Group’s expertise in etching processes for microchip production that enables efficient production,” commented Christian Buchner, responsible for the photovoltaic division at Schmid.

An ultrashort pulse laser from Trumpf selectively changes the structure of the glass, which is then treated with an etching solution. The desired holes are created at the specified locations and then filled with copper to form the conductor tracks.

“The laser and etching processes must be perfectly coordinated to create precise holes. Only through close cooperation between the two companies can we achieve the extreme levels of accuracy that are standard in the industry,” said Buchner.

Future market

According to market analyst Boston Consulting Group, the market for advanced microchip packaging is expected to grow to more than 96 billion dollars by 2030. For Trumpf and Schmid, advanced packaging with the help of glass could also develop into an important future market.

Currently, applications in consumer electronics such as smart phones dominate the advanced packaging sector. In the future, applications in the field of artificial intelligence are likely to be the growth drivers.

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