Epoxies

Two part, silver filled, electrically conductive adhesive for high performance bonding and sealing. Low volume resistivity, cryogenic, outstanding toughness, NASA low outgassing.

A cryogenic, two part, low outgassing epoxy system with service from 4K to +250ºF and a refractive index of 1.55. Exhibits outstanding spectral transmittance of over 97% from 300-2,000 nm.

Highly flexible, low viscosity, optically clear adhesive. Resistant to severe thermal cycling and thermal shock. Bonds well to dissimilar substrates. Low exotherm system. Long working life. Superior electrical insulation properties.

Moderate viscosity, structural epoxy adhesive features high temperature resistance and optical clarity. NASA low outgassing, electrically insulative, high physical strength properties. Withstands 1,000 hours 85°C/85% RH.

Two component epoxy for bonding, coating, sealing and potting featuring superior non-yellowing properties and enhanced storage stability. Low viscosity, electrically insulative, NASA low outgassing.

Very low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. Superb electrical properties, temperature resistant, non-yellowing, optically clear.

Thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. High glass transition temperature, low coefficient of thermal expansion.

Two part epoxy with a very low coefficient of thermal expansion (CTE). Thermally and electrically insulating, flows readily, low shrinkage upon cure, dimensionally stable. Cryogenic, NASA low outgassing.

Two component, thermally conductive, heat resistant epoxy compound for service from 4k up to 400°F. Low CTE, easy to apply, with a paste consistency. Passes NASA low outgassing tests and withstands 1,000 hours 85°C/85% RH.

EP4NS-80 is a one component, optically clear nanosilica epoxy for bonding and sealing with curing temperature of 80°C to 85°C that meets NASA low outgassing.