Anvik wins ARPA contract to develop lithography system

17 Jun 2002

Anvik Corporation has been awarded a $2.2 million contract by the Advanced Research Projects Agency (ARPA) to develop a high-throughput lithography system for the production of printed circuit boards (PCBs)and multi-chip modules (MCMs) on flexible substrates. The Anvik system will enable the cost-effective production of PCBs and MCMs in high-volume, foll-to-roll manufacturing process, said Anvik president, Dr. Kanti Jain.

"This broadens the applications for high-throughput, high-resolution patterning of large substrates for volume production of a variety of electronic modules, including flat panel displays, multi-chip modules, and printed circuit boards," Jain said.

"We are in a position similar to that of the IC industry in the 1970s, when they had to make the jump from contact printing to projection lithography," noted Glenn Gengel, technical manager for Sheldahl Micro Products division. The completed Anvik system is scheduled to be installed at the Sheldahl division plant in Longmont Colorado.