01 Jun 2023 Silicon Wafer 4″ P Type Semiconductor memory chips are manufactured in cleanroom environments because the circuitry is so small even tiny bits of dust can damage it. Class 1 and class 10 cleanrooms are typical. In a class 1 clean room, there is no more than 1 particle of dust in a cubic foot of air. In comparison, a clean, modern hospital has about 10,000 dust particles per cubic foot. The air inside a cleanroom is filtered and recirculated continuously, and employees wear special clothing such as dust-free gowns, caps, and masks to help keep the air particle-free. which accepts Phosphorus Doped Silicon Wafer from the factory materials handling system, aligns them for processing in the etch machine, and moves them into the main part of machine. specification:
| Product Name |
Silicon Wafer P Type (Pt/Ta/Si) |
| Product Code |
NS6130-10-1152 |
| CAS |
7440-56-4 |
| Diameter (mm) |
4" (101.6mm) |
| Type |
P Type |
| Doping |
(Pt/Ta/Si) |
| Crystal Orientation |
<100> |
| Surface |
Single Side Polished |
| Thickness |
275 μm |
| Resistivity |
1-10ohm-cm |
| Quantity |
25 Wafers |
| RRG (%) |
≤12 |
| Oxygen Contents (ppma) |
12.5-16.5 |
| Carbon Contents (ppma) |
≤1 |
According your require, we can produce customized silicon wafers, no matter what diameter, thickness or type. We expect to service you. |