Innovative encapsulants for microelectronics

31 Oct 2012

DELO, manufacturer of industrial adhesives, presents convincing high-reliability DELOMONOPOX encapsulants for microelectronics. These materials combine exceptional properties with excellent handling behavior.

The role that high-reliability encapsulants play for appropriate packaging of microelectronic components subjected to aggressive surrounding conditions such as fuels, oils, vibration, and extreme temperatures, is an ever-growing one.

The new encapsulants combine outstanding material properties such as chemical resistance, mechanical properties, excellent adhesion, optimized dispensing and flowing properties and variable curing parameters. Thanks to this successful development, production processes can be designed in a notably more flexible and efficient way. This helps users cut down production costs and boost output, while receiving the utmost product quality.

DELO’s newly developed encapsulants will certainly find the customers’ approval, not least thanks to their excellent properties.

Any questions about DELOMONOPOX encapsulants? Contact us or visit our website: http://www.delo.de/anwendungsfelder/semiconductor-packaging/