16 Dec 2010 Master Bond has developed unique epoxy, polyurethane, polysulfide and UV cure formulations specifically designed for stress dissipation. Master Bond compounds are stress absorbing and have a low modulus of elasticity. Primarily used in optical, electro-optical, electronic, fiber-optic and photonic applications these systems offer low shrinkage, low outgassing and cure at ambient conditions. Master Bond products have improved moisture resistance and the ability to withstand exposure to thermal cycling and vibration, impact and shock. Master Bond has developed innovative products for adhering substrates with large differences in their coefficients of expansion and contraction exposed to wide temperature cycles.
Specific grades offer:
- High reliability
- Low ionic impurities
- Low outgassing
- Fast cures
- Reworkability
- High dielectric strength
- Low dielectric constant
- Thermal stability
- Gap filling
- Optical clarity
- Low shrinkage
- Easy application
- Electrical and thermal conductivity
- Moisture and chemical resistance
- Resistant to vibration, impact and shock
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