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UV Laser Precision Micro Machining System

02 Nov 2009

This system delivers high performace in cutting, drilling and surface treatment in glass, Ceramic, Sapphire, Silicon, Cu, Alloys and organic films with high throughput, good quality and flexibility.

With strong technical capability and process experience, delphilaser successful developed a new generation high-end laser system. Specifications: FinePioneer/QuickSweeper Wavelength: 355nm Pulse width: 8-15ns Average power: 3W\6W\8W Pulse energy stability: <3%RMS Maximum aspect ratio: 4: 1 Minimum diameter: 70um Features 1. High efficiency, high stability 2. Small thermal effect, excellent in shape 3. Suitable for a variety of graphics formats 4. High density drilling Applications Main applications in micro-drilling, cutting on glass, Ceramic, Sapphire, Silicon, Cu, Alloys and organic films, especially on hard and brittle materials such as glass, Ceramic, Sapphire, etc.

CONTACT DETAILS
Suzhou Delphi Laser Co., Ltd
No.77, Suhong Middle Road, Suzhou
Suzhou
Jiangsu
215021
China
Tel: 86-512-87189094-8015
Fax: 86-512-87189097
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