23 Aug 2006 The CDP, Chemical Delayering and Planarization Polishing System is a highly versatile chemical mechanical polishing system designed for use in polishing applications where geometric precision and surface quality are of paramount importance. Through a combination of automated parameter control and unique processing versatility, the CDP automatic polisher provides repeatable nanometer level accuracy for the majority of materials used in current day device fabrication processes. Due to its accuracy, low CoO (Cost of Ownership) and ease of use, the CDP automatic polisher offers the ideal environment for CMP and Delayering applications.
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