12 Jun 2006 Simulation of semiconductor optoelectronic devices (lasers, LED, photodetector, amplifier, modulator, solar cell, quantum well/wire/dot structures, transistor, SOA, VCSEL, etc). APSYS, Advanced Physical Models of Semiconductor Devices, is based on 2D/3D finite box analysis of electrical, optical and thermal properties of compound semiconductor devices, with silicon as a special case. Emphasis has been placed on band structure engineering and quantum mechanical effects. Inclusion of various optical modules also makes this simulation package attractive for applications involving photosensitive or light emitting devices.
LASTIP, Laser Technology Integrated Program, was historically the first product of Crosslight Software Inc., dedicated primarily to 2D simulation of edge emitting laser diodes. It brought methods of CAD to the laser community which over time achieved the maturity level similar to the one seen in silicon IC industry. It includes optical gain model for quantum well/wire/dot or bulk material with different types of spectral broadening, Coulomb interaction, and kp non-parabolic subbands. It also accurately treats multiple lateral modes interactions.
PICS3D, Photonic Integrated Circuit Simulator in 3D, is a state of the art 3D-simulator for surface and edge emission laser diodes, SOA, and other similar active waveguide devices. 2/3 dimensional semiconductor equations (drift-diffusion) are coupled to the optical modes in lateral and longitudinal directions. Optical properties such as quantum well/wire/dot optical gain and spontaneous emission rates are computed self-consistently.
CSUPREM (Crosslight-SUPREM) is a process simulation software package based on the SUPREM.IV.GS code developed at Integrated Circuits Laboratory, Stanford University. SUPREM.IV.GS has been recognized as the industrial standard in process simulation for integrated circuit (IC) design for over a decade. Crosslight greatly enhances the capability of the original code from Stanford and extends it from 2D to 3D.
PROCOM (PROcesses of COMpounds) is a 2/3-dimensional process simulation software package for compound semiconductor growth by Metal-Organic Chemical Vapor Deposition (MOCVD). Given the deposition reactor geometry, chemical species and growth condition parameters, PROCOM predicts the semiconductor film growth rate, composition, thickness uniformity, dopant incorporation and defect distribution based on detailed chemical kinetics and mass/heat transfer models. |
