Eugenlight Releases High-Power ELSFP Product Series for NPO and CPO Applications

Eugenlight Releases High-Power ELSFP Product Series for NPO and CPO Applications

 
CHENGDU, China – September 3, 2026 – Eugenlight Technologies, a specialized developer and manufacturer of high-speed optoelectronic components, has launched its new UHP and VHP ELSFP (External Laser Small Form Factor Pluggable) product series, purpose-built to address evolving NPO and CPO deployment demands for next-generation AI data center networks.

As global hyperscalers accelerate the verification and mass deployment of NPO (Near-Package Optics) and CPO (Co-Packaged Optics) switch platforms, the two architectures have become the mainstream solution for high-density AI computing clusters, supercomputing systems, and ultra-scale data center infrastructures. Traditional pluggable optical modules face inherent power and thermal bottlenecks at 800G, 1.6T, and beyond, limiting further bandwidth scaling.

As a critical building block for 51.2T and 102.4T NPO/CPO switch systems, the pluggable ELSFP architecture separates heat-sensitive laser components from high-power electrical switching chips. The physical isolation effectively resolves power density and thermal dissipation limitations at ultra-high speeds, while retaining hot-pluggable capability. This design significantly reduces data center operational risks, lowers maintenance costs, and improves overall network reliability for HPC interconnections and spine-core data center layers.

Figure 1. Eugenlight ELSFP Structure Diagram

Advanced Proprietary Process Delivers Superior Coupling Efficiency

Eugenlight’s new ELSFP lineup fully complies with the OIF-ELSFP-02.0 industry standard. The product integrates dual 12-fiber MT ferrules with insertion loss below 0.3 dB per channel. All channels adopt low-bend-loss polarization-maintaining fiber, delivering a polarization extinction ratio (PER) exceeding 20 dB.

Leveraging in-house process development, Eugenlight has built a fully automated lens and fiber array unit (FAU) coupling and curing system. The proprietary manufacturing setup achieves optical coupling repeatability error below 3%, inter-channel deviation under 3%, and post-curing stability error within 5%.

The company’s in-house-developed lens and fiber-array coupling equipment is precisely optimized to match the product structure and optical-path design, delivering improvements in coupling efficiency and laying a solid foundation for future mass-production consistency. The chip-to-fiber batch production coupling efficiency can reach over 85%, demonstrating Eugenlight’s robust technical capabilities in optoelectronic integrated packaging.

High Power Output and Optimized Thermal Design for Hyperscaler Deployments

Eugenlight’s ELSFP modules feature a socket-type connector structure that shortens connection distance, reduces insertion loss, and simplifies on-site disassembly and PCBA maintenance. The module’s top cover enables full-contact heat dissipation, combining high optical coupling efficiency with robust thermal management.

The UHP ELSFP variant delivers continuous output power above 23 dBm per lane with a driving current below 1 A, while maintaining a total module power consumption as low as 13.5W. The VHP ELSFP provides over 20 dBm per lane with power consumption under 10W, offering flexible power-performance options for different NPO/CPO system configurations.

Mass Production Roadmap to Support Global NPO/CPO Customers

Eugenlight has completed engineering sample (ES) validation for both VHP and UHP ELSFP models from Q4 2025 to Q2 2026. Pilot production is scheduled for Q3–Q4 2026, with formal mass production (volume shipment) kicking off in Q1 2027.

Backed by parent company USI and ASE HOLDINGS’ global manufacturing ecosystem, Eugenlight will leverage its production bases in Haiphong, Vietnam &Chengdu.The dual-site manufacturing layout supports customized product development, technology transfer, and scalable mass production to meet growing global NPO/CPO market demands.

About Eugenlight Technologies

Founded in 2016, Eugenlight Technologies focuses on the R&D and volume manufacturing of high-speed optoelectronic components and optical engine products for data center and optical networking applications. The company offers a full product portfolio covering 100G to 1.6T high-performance optical devices, silicon photonics integration, and NPO/CPO co-packaged optical solutions.

Acquired by USI in Jan 2026, Eugenlight serves as a key pillar of USI and ASE HOLDINGS’ global optical interconnection ecosystem. The company collaborates with worldwide top-tier customers to accelerate the industrialization and large-scale deployment of next-generation co-packaged optics technologies.