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Date Announced: 23 May 2011
The Lasers & Material Processing division of Jenoptik will have the more powerful version of the green disk laser type JenLas® D2.mini, a femtosecond laser for industrial applications and a new infrared disk laser for micro materials processing on display at the LASER World of PHOTONICS from May 23-26, 2011. In addition to that, the presentation will highlight the full performance spectrum – the value chain – of the division.
Compact Green Disk Laser with Improved Output Power
Hardly a year after launching the serial production of the compact medical laser JenLas® D2.mini 2/3 W Jenoptik now presents the more powerful version of this diode-pumped green disk laser.
The new JenLas® D2.mini 5/8 W with up to 8 W output is an improvement based on the innovative JenLas® D2.mini technology. With small volume, its very compact shape, optimized beam quality and higher output, this laser will generate even more interest for applications in medicine as well as for shows and entertainment. This laser can be used for laser therapy in aesthetics and dermatology.
The simple integration of the robust laser in different small devices is a fundamental benefit for the customer. The green disk laser type JenLas® D2.min 5/8 W with improved output power will be demonstrated in a live display at the Jenoptik booth #C2.411.
Femtosecond Laser for Optimal Application in Industry
The new JenLas® D2.fs is another product from the Jenoptik laser range. Based on the diode-pumped disk laser technology, this laser provides outstanding parameter stability and defines a new standard in laser sources of the femtosecond class. Developed for application in industrial environments, the working temperature range was extended to 15–35 °C. The laser emits high pulse energies of max. 40 μJ at 100 kHz repetition rate and can operate in the 30-200 kHz range. The beam quality of M² ≤ 1.25 near the theoretical limit, together with pulse duration of ≤ 400 fs opens new laser applications in industry.
To ensure industry capability, every laser is subjected to strict type tests to guarantee safe function under typical conditions of transportation, storage and operation. This includes climate and shock tests, noise immunity to external electrical noise and compliance with the low EMC standards for electrical noise emission. Major features include ease of integration of the turn-key laser in complex machines and plants. For example, the actuation signal can be released by software or hardware.
Due to the specific properties of the impact of ultra-short femtosecond laser pulses on different materials, new laser applications can be found. For example, these laser pulses are excellent for all material processing applications for which minimal heat effects during processing are important. Another area includes processing inside of transparent materials, such as glass, transparent plastics and transparent function layers. A third and final field of application is the selective ablation of individual layers in multiple-layer systems consisting of different materials. Concrete industry applications in these areas include the 3D-micro material ablation of metal or polymer (e.g., cutting of stents), thin layer ablation in the semiconductor industry or the removal of dielectric layers on crystal solar cells in photovoltaics. Other applications are the scribing of sapphire substrate, the processing of dental ceramics and the internal marking of glass.
Extension of the Jenoptik Disk Laser Product Family for Micro Materials Processing
The new infrared disk laser JenLas® disk IR70 will also be on show. Thus, the Jenoptik disk laser product family, including the JenLas® disk IR50 already known in the market, is supplemented with a powerful variant. The laser particularly fulfils the requirements of the new technologies in the photovoltaic sector such as metal wrap-through (MWT) or emitter wrap-through (EWT – up to 20,000 holes/second), laser fired contact (LFC) or laser edge isolation.
The electrical efficiency of the solar cells is increased by applying the MWT or EWT technology. With both technologies the contacts are installed on the rear side of the cell instead of the front side in order to enlarge the active cell surface. The previously customary contact tracks shadowing parts of the active surface are thus partly eliminated.
Other applications of micro materials processing include the cutting of stents, micro structuring and drilling and drilling of metals.
The pulse lengths of the lasers are adjustable independently of the repetition rate so that optimal process parameters can be set. With a pulse energy of up to 7 mJ and repetition rates of up to 100 kHz the JenLas® disk IR70 covers a broad spectrum of applications in the infrared wavelength range of 1,030 nm. Thus, the 65 watt system is ideal for laser-based drilling of silicon wafers for the production of efficient solar cells with rear side contacts.
Latest Diode Novelties now also Presented to the European Market
The novelties in the diode laser product line displayed for the first time at Photonics West in the U.S.A. in January 2011 are now also presented to the public at Europe’s most important photonics exhibition.
They comprise the easy-to-handle qcw module JOLD-x-QA-8A with integrated vertical diode laser stack and industrial water cooling for industrial, military and medical applications and the high-brilliance, fiber-coupled diode laser module JOLD-75-FC-11 with 75 W output power (105 μm fiber, NA 0.15) for the optical pumping of fiber lasers.
E-mail: info.lm@jenoptik.com
Web Site: www.jenoptik.com/laser2011
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