 |
 |
Date Announced: 01 Mar 2011
Technology Featuring Multiple Bandwidths for XLR and XLA Series Immersion Light Sources Leads to Higher Yield.
SAN DIEGO, March 1, 2011 /PRNewswire/ -- At SPIE Advanced Lithography 2011, Cymer, Inc. (Nasdaq:CYMI - News), the world's leading supplier of light sources used by chipmakers to pattern advanced semiconductor chips, today announced the development of new focus drilling technology for its immersion light sources including the XLR 600ix, XLR500i, XLA 400 and XLA 300. Focus drilling provides up to a 2X improvement in the depth of focus on the wafer, thereby enabling a larger process window that can positively impact chipmakers' yield.
Laser focus drilling technology was developed to aid chipmakers in patterning deep contact and via structures with thick resists where high depth of focus is required. Cymer's focus drilling solution is supported by a technique involving operation of the light source at multiple bandwidths utilizing metrology that was designed to measure high-bandwidth spectra. Additionally, the unique spectral shape of Cymer's light sources can improve depth of focus with minimal impact on other key process parameters.
"This technology and its benefits to chipmakers is the result of more than five years of development effort at Cymer, investigating multiple approaches to improving depth of focus through spectral engineering," said Ed Brown, president and chief operating officer of Cymer. "Our close collaboration over the past year with our direct scanner and chipmaker customers was instrumental in developing an optimum solution."
Light sources equipped with focus drilling are being qualified, and are currently under chipmaker evaluation.
Source: Cymer
E-mail: pbowman@cymer.com
Web Site: www.cymer.com
| © 2024 SPIE Europe |
|
