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U.S. Department of Commerce Announces CHIPS for America R&D Leaders

Date Announced: 07 Jun 2023


WASHINGTON, D.C., USA — In remarks to the Industrial Advisory Committee (June 5th, 2023), Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio will announce five leaders joining the CHIPS Research and Development Office within CHIPS for America. CHIPS for America was established by historic legislation to bring semiconductor manufacturing back to the U.S. and to solidify the country’s leadership in technology and innovation.  

“While the manufacturing incentives of the CHIPS Act will bring semiconductor manufacturing back to the U.S., the CHIPS R&D programs will ensure America’s global leadership by creating a robust semiconductor R&D ecosystem,” said Secretary of Commerce Gina Raimondo. “These leaders bring exactly the depth and breadth of organizational, programmatic and technical leadership experience that CHIPS needs to stand up new, transformational R&D programs.”

“We are building a national R&D ecosystem that will keep our budding semiconductor manufacturing base one of the world’s most technologically advanced,” said Locascio. “To make the CHIPS R&D programs into bustling centers of innovation, we need the country’s best people to execute our vision. These are the experts who will propel CHIPS for America and the nation’s semiconductor sector forward.” 

The announced CHIPS Research and Development (R&D) Office leaders are:

  • Lora Weiss, Director 
  • Eric Lin, Deputy Director 
  • Neil Alderoty, Executive Officer 
  • Richard-Duane Chambers, Associate Director for Integration and Policy
  • Marla Dowell, Director of the CHIPS R&D Metrology Program

CHIPS for America comprises the CHIPS Program Office, responsible for semiconductor incentives, and the CHIPS R&D Office, responsible for four integrated programs that will generate innovations that make American semiconductor manufacturers globally competitive. The four programs are the National Semiconductor Technology Center (NSTC), the National Advanced Packaging Manufacturing Program, up to three new Manufacturing USA institutes dedicated to semiconductors, and the CHIPS R&D Metrology Program.

More information on each of the Leaders is available here on the NIST website.

The CHIPS R&D Office is staffing up with nationally recognized experts while also achieving important milestones. The office recently released the following: 

A publication describing the vision for the National Advanced Packaging Manufacturing Program is expected later this summer. Additional leadership announcements are expected in June. 



E-mail: matt.hill@chips.gov

Web Site: chips.gov

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