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Date Announced: 16 Dec 2010
HACKENSACK, NJ - December 14, 2010 - Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. With a thermal conductivity over 22 BTU/in/ft²/hr/ºF and serviceability from -60 to 400°F, Master Bond EP21ANHT delivers outstanding performance in the most demanding microelectronic applications. The cured adhesive is also a superior electrical insulator, further expanding its usefulness.
This two component adhesive, sealant, and coating has a convenient 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of >400 volts/mil, and a tensile shear strength greater than 1,000 psi. It resists a wide range of chemicals and adheres well to a variety of substrates.
EP21ANHT is available in pint, quart, gallon and 5 gallon kits.
Master Bond Thermally Conductive Epoxy Systems
Master Bond EP21ANHT thermally conductive epoxy system delivers outstanding heat transfer and high temperature resistance. Read more about Master Bond's thermally conductive epoxies at http://www.masterbond.com/lp/tabs/tp_pp_thermcond.html or contact Technical Support by phone at +1-201-343-8983, by fax at +1-201-343-2132 or by e-mail at technical@masterbond.com.
E-mail: hevans@masterbond.com
Web Site: www.masterbond.com
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