Mr Aimo Xiao, CEO of Huatian stated, "Orbotech's SPTS Technologies is a valued supplier and production partner of Huatian, and their PVD solutions continue to play a key role in the success of our CIS wafer-level packaging business. We believe that the Emerald system will enable us to explore new applications in this growing industry while remaining cost competitive with innovative solutions for our global customers."

"This is a further example of Orbotech's core technologies being leveraged for SPTS' semiconductor customers. The demand for ever-smaller devices with more features and higher performance continues to drive the semiconductor industry to adopt innovative process solutions at a lower total cost of ownership," stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. "Huatian already employs our Sigma fxP PVD systems in their 300mm CIS (CMOS image sensor) packaging lines. The addition of the Emerald laser drilling system to their CIS packaging lines will enable Huatian to improve their capabilities for small pitch CIS packaging schemes with a more reliable, more accurate and more cost-efficient through-hole via processing."

About Emerald^™ series Laser Via Formation  

Orbotech's Emerald series Laser Via Formation systems simultaneously drill eight areas on a panel through patented Multi-Path Technology. High-power UV laser via formation achieves the best registration accuracy in the market. The Emerald series UV Laser Via Formation supports below 20 μm via drilling through ABF, polyimide, ceramic, resin, mold compounds, metal and solder resist substrates with no residue or damage to the bottom of the via, and no undercut.

Source: Orbotech