Out of pyramids - new 3-stage thermoelectric cooler types

Date Announced: 16 Jun 2010

TEC Microsystems and RMT introduce new range of miniature 3-stage thermoelectric coolers - 3MDC types with specially enlarged cold side area. 3MDC coolers combine standard and HD pellets placement technologies. The dimensions of 3MDC coolers top and bottom ceramics plates are the same. This is optimal for detectors, creating of TE cooler arrays, TEC packaging and handling. New 3MDC TECs have up to 60% higher cooling capacity, comparing with typical solutions of the same size available on the market.

Contact

E-mail: info@tec-microsystems.com

Web Site: www.tec-microsystems.com