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Lasertel Expands Production Capacity With Veeco MBE System

Date Announced: 23 Apr 2012

SELEX subsidiary ramps capacity for high-performance chips at Tucson, Arizona, fab.

TUCSON, Ariz. & PLAINVIEW, N.Y.--(BUSINESS WIRE)--Lasertel, Inc. a subsidiary of SELEX Galileo Inc., a Finmeccanica company, and Veeco Instruments Inc. (Nasdaq: VECO) announced today that Lasertel has purchased a second high-throughput, multi-wafer GEN200® Edge™ Molecular Beam Epitaxy (MBE) production system from Veeco to increase their manufacturing capacity for laser diodes.

“The additional GEN200 Edge production MBE system provides the extra capacity required to support the increased demand for Lasertel devices. The GEN200 system offers advanced automation, precise process control, and in-situ process monitoring. It is the core enabling technology for Lasertel’s leading-edge, high performance semiconductor diode laser devices,” says Mark McElhinney, President of Lasertel.

Lasertel is enhancing the manufacturing capabilities of its high volume, semiconductor laser fabrication and packaging facility in Tucson, Arizona to support growing demand for its current class-defining product portfolio. This brings their in-house complement of MBE tools to four with the latest to be used to accelerate the development of next-generation, high-performance diode laser products. The expansion is planned to be completed by Q4, 2012.

Jim Northup, Vice President and General Manager of Veeco’s MBE Operations, commented, “We look forward to supporting Lasertel in their continued growth with the Veeco GEN200 system, part of our suite of the industry’s most cost-effective and highest-capacity production MBE systems.”

Source: Veeco/Lasertel

Contact

Lasertel
Robert Walker,
520-744-5700
Director of Sales and Marketing

E-mail: via web site

Web Site: www.lasertel.com

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