Cassette carrying several hundred chips intended for100 Gb/s transceivers, diced from wafers fabricated with IBM CMOS Integrated Nano-Photonics Technology. The dense monolithic integration of optical and electrical circuits and the scalable manufacturing process provide a cost-effective silicon photonics interconnect solution, suitable for deployment in cloud servers, datacenters, and supercomputers. (US quarter coin shown for scale.) Credit: IBM. |
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