SPIE DCS 2024: Hyperspectral imaging platform for low-earth orbit to make its debut

17 Apr 2024

Corning, Flir, and many others to present sensing innovations for defense, security, and government applications.

SPIE Defense + Commercial Sensing 2024 (SPIE DCS), taking place between 21-25 April 2024 in National Harbor, Maryland, U.S.A., offers an opportunity for learning about sensing technologies being developed and deployed within public, security, and government applications.

The 2024 program — comprising 40 conferences and 20 courses — is now online, and researchers and engineers can benefit from exploring the latest advancements in sensors, infrared, laser systems, spectral imaging, radar, lidar, autonomous systems, and more. Following is a selection of exhibitor highlights.

Exhibitor Corning is to present its latest innovations for the aerospace and defense industry, including the latest in hyperspectral-imaging technology. The company will present its customizable platform for low-Earth orbit. With a ground sampling distance of 8 meters, the technology is capable of sensing from the ultraviolet to the short-wave infrared (equivalent to 400-2,500 nm).

The platform’s onboard computing, storage, and processing capabilities deliver exceptional optical and sensor performance. It also includes a flexible electro-mechanical interface design suitable for a variety of host platforms and functions.

At the Corning booth (#1112), visitors will be able to view:

• A Large Aperture Primary Mirror Designed for Orbital Sidekick (OSK) This lightweight-aluminum primary mirror is a key component in the hyperspectral sensor for six of OSK’s GHOSt™ low-Earth-orbit satellites. Capturing nearly 500 bands of light, OSK uses the technology to pinpoint methane leaks across millions of miles of oil and gas pipelines; and
• An interactive Remote Sensing Demonstration This display will feature commercial hyperspectral technology in action with Corning’s microHSI™ family of hyperspectral sensors and systems. Visitors will be able to detect specific materials and conditions, like iron ore and crop ripeness, in a simulated Earth environment.

Qualcomm-built advanced video processor by Flir

Also at SPIE DCS, Flir will present its AVP, which is described as an “advanced video processor designed to power the firm’s Prism AI and computational imaging at the edge”.

The AVP incorporates the latest Qualcomm QCS8550 mobile processor chip, designed to support mobile, automotive, and robotics system-on-chip technologies. The AVP provides AI performance within a small, low-power module for thermal and visible camera integration into UAVs, robots, handheld devices, and security systems.

Trained on the world’s largest thermal image ”data lake” of more than 5 million annotations, Prism AI is a perception software designed to detect, classify, and track targets or objects for automotive autonomy, automatic emergency braking, airborne camera payloads, counter-drone systems, ground intelligence, and security sytems.

A complete list of exhibitor announcements is available on the SPIE DCS website.