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| A panel discussion at SPIE Advanced Lithography + Patterning on the future of EUV lithography. From left to right: Mark Slezak, JSR (Japan); Jan van Schoot, ASML (Netherlands); Emily Gallagher, imec (Belgium); Frank Abboud, Intel (USA); Youngseog Kang, Samsung (RoK); and Andreas Erdmann, Fraunhofer IISB (Germany). |
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