 |
| Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) is a cross-section of the EIC-PIC assembly with µbumps. (D) Shows the mesh of the finite element model. Credit: The Authors, doi: 10.1117/1.JOM.4.1.011004. |
| © 2024 SPIE Europe |
|
