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Jie Ren with mini heatsink fan.
UMass Amherst Ph.D. student Jie Ren holds a miniature heatsink fan, one of the 3D printed high-entropy alloy components made in Wen Chen’s lab. The microstructure’s atomic rearrangement gives rise to ultrahigh strength as well as enhanced ductility, research by UMass Amherst and Georgia Tech shows.
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