daily coverage of the optics & photonics industry and the markets that it serves
PhotonicLEAP’s wafer-level PIC process is set to yield >10 times reduction in PIC production costs. Click for info.
PhotonicLEAP’s novel wafer-level PIC packaging and test technology will be used to produce a “revolutionary” Surface Mount Technology (SMT) PIC package, combining breakthroughs in advanced materials, innovations in optical and electrical packaging and ultra-fast wafer-level assembly processes giving >10 times reduction in PIC production costs. Graphic courtesy of PhotonicsLEAP program.
Copyright © 2022 SPIE EuropeDesigned by Kestrel Web Services