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PhotonicLEAP’s wafer-level PIC process is set to yield >10 times reduction in PIC production costs. Click for info.
PhotonicLEAP’s novel wafer-level PIC packaging and test technology will be used to produce a “revolutionary” Surface Mount Technology (SMT) PIC package, combining breakthroughs in advanced materials, innovations in optical and electrical packaging and ultra-fast wafer-level assembly processes giving >10 times reduction in PIC production costs. Graphic courtesy of PhotonicsLEAP program.
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