LEW Techniques

LEW Techniques specialises in the manufacture of miniature components and microcircuits for the mounting of semiconductor devices. Typically, our components are used for mounting LEDs, laser diodes and photodiodes, RF circuits, hermetic packages and windows and other associated items. Our in-house capabilities include thin-film, thick-film and refractory metallizing of ceramics and metals, electroplating, precision dicing, laser machining, atmosphere/vacuum brazing and solder assembly.