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GDSI

Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications targeting unit cost reduction and maximum product yield. GDSI has perfected the process of mechanical stress reduction in ultra-thin wafers after a decade of R&D.

CONTACT DETAILS
GDSI
925 Berryessa Road
San Jose
CA
95133
United States
Tel: 001 408 451 2000
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