daily coverage of the optics & photonics industry and the markets that it serves
This scribing system from Oxford Lasers looks set to help manufacturers of blue laser diodes and LEDs. Using a copper vapour laser, it improves the way in which sapphire-based semiconductor wafers cleave, which should boost device yields. Inset: the laser produces a deeper cut than a diamond tool, which makes the cleaving process more predictable. (Credit: Oxford Lasers)
Copyright © 2022 SPIE EuropeDesigned by Kestrel Web Services