IMRA Agrees with DISCO to Jointly Develop Laser Dicing

Date Announced: 19 Mar 2012

Femtosecond lasers should minimize any heat damage to processed chips.

KARIYA, Japan, March 19, 2012 /PRNewswire/ -- IMRA America, Inc., a subsidiary of Aisin Seiki Co., Ltd., and DISCO Corporation have agreed to collaborate in the development of new lasers and processing systems for laser dicing of semiconductor materials.

IMRA America has supplied several hundred femtosecond fiber lasers* that are now being used in semiconductor manufacturing facilities, delivering the high reliability and stability required for 24/7 operation. Also, IMRA America is the exclusive licensee of US Patent 5,656,186 by the University of Michigan, essential for femtosecond and picosecond laser materials processing, which they license to their customers.

In the future, both companies will together provide new solutions utilizing the unique capabilities of femtosecond lasers, which minimize thermal effects in materials processing.

Source: IMRA America

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