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| Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) is a cross-section of the EIC-PIC assembly with µbumps. (D) Shows the mesh of the finite element model. Credit: The Authors, doi: 10.1117/1.JOM.4.1.011004. |
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