10 Jul 2013 A common task in the most diode laser assemblies is the joining of a laser diode chip to a submount or
heat spreader. Especially for single emitter layouts this process is quite similar throughout the variety of
components. ficonTEC, known for its portfolio of high precision fully automatic die bonders, introduces a
new member to its machine family.
The BL500-COS is a specialist for what its name already indicates. The eutectic die bonder was designed
for the manufacture of Chip-on-Submount (COS) assemblies. It uses high precision metrology in
combination with a high performance motion system for sub-micron bonding accuracy. A diode laser
soldering engine supplies the machine with the capability necessary for short production cycles.
As the leading manufacturer for fully automated and semi-automatic machines for high precision die
bonding and testing in the photonic and opto-electronic industry, we are looking forward to introducing
individual product solutions to you.
www.ficontec.com
info@ficontec.com | 
